News Overview
- AMD has reportedly taped out (completed the design phase) their Zen 6 “Venice” CPU chiplets.
- These chiplets will be manufactured using TSMC’s advanced 2nm (N2) node.
- The expected launch timeframe for Zen 6 based products is sometime in 2026 or later.
🔗 Original article link: AMD Tapes Out Zen 6 “Venice” CPU CCDs Using TSMC N2 Tech
In-Depth Analysis
The article reports on a significant milestone in AMD’s CPU development roadmap: the tape-out of their Zen 6 architecture-based CPU chiplets, codenamed “Venice.” Tape-out is a critical stage, signifying that the design has been finalized and is ready for manufacturing.
Key aspects:
- Zen 6 “Venice”: This is the architectural codename for AMD’s next-generation CPU core design succeeding Zen 5 (“Granite Ridge” for desktop, “Strix Point” for mobile APUs) which itself follows Zen 4 and Zen 4c cores. While no specific details of architectural improvements are provided, the move to a new generation typically involves significant performance gains in terms of Instructions Per Clock (IPC), power efficiency, and new feature sets.
- TSMC N2 Node: TSMC’s 2nm node (N2) represents a further miniaturization of transistor technology, enabling higher transistor density, improved performance, and lower power consumption compared to previous generations (like N3 and N3E used for Zen 5). This node is expected to be a significant leap forward in semiconductor manufacturing.
- Chiplets (CCDs): AMD has been using a chiplet-based design for their Ryzen and EPYC CPUs for years. This involves packaging multiple smaller CPU dies (chiplets or CCDs - Core Complex Dies) together on a single package. This approach allows for more flexible and cost-effective CPU designs compared to monolithic dies. By taping out the CCD design on N2, AMD is indicating that the N2 process will be used for the CPU cores and any related logic within those CCDs.
- Timeline: The article indicates that the Zen 6 based products are not expected to arrive before 2026. This suggests a considerable lead time is needed to refine the design, optimize manufacturing processes, and integrate the Zen 6 chiplets into final products.
Commentary
The tape-out of Zen 6 on TSMC’s N2 node highlights AMD’s commitment to pushing the boundaries of CPU performance and efficiency. This move positions AMD to compete strongly in both the desktop and server markets against Intel. The switch to N2 from N3/N3E is expected to bring significant improvements in performance per watt. This is especially important in the face of increasingly power-hungry hardware.
However, a 2026 timeframe means that AMD will have to navigate several competitive product releases from both Intel and possibly other emerging competitors using their own novel architectures. The success of Zen 6 will also depend on TSMC’s ability to deliver a stable and high-yielding N2 process on schedule. Any delays in TSMC’s N2 rollout could potentially impact AMD’s product launch plans.
The adoption of Zen 6 on N2 positions AMD strongly for future products. The longer lead-time also suggests AMD may be planning a more significant architectural overhaul than previous Zen iterations.