News Overview
- A new CPU water block from Supercool.org, called the “Direct Die Frame,” features extremely fine microfins (as small as 0.08mm) designed to be placed directly on the CPU die, bypassing the integrated heat spreader (IHS) for improved heat transfer.
- The Direct Die Frame includes a delidding kit to safely remove the IHS and a frame to protect the exposed die and ensure proper contact.
- Early testing suggests this direct-die cooling method can significantly lower CPU temperatures compared to traditional water blocks.
🔗 Original article link: This water block has teeny tiny fins to better cool your CPU and is meant to be slapped right on top of your silicon
In-Depth Analysis
The core innovation of the Supercool.org Direct Die Frame lies in its microfin design and direct-die contact. Traditional CPU water blocks cool the IHS (Integrated Heat Spreader), which acts as an intermediary between the CPU die and the cooler. This adds a layer of thermal resistance, hindering heat transfer. The Direct Die Frame eliminates this layer by placing the water block directly on the CPU die.
The use of ultra-fine microfins (0.08mm) significantly increases the surface area for heat exchange between the CPU die and the coolant. The article mentions a larger baseplate compared to previous direct die coolers which improves CPU socket compatibility across generations.
The product includes a delidding kit, which is crucial for safely removing the IHS without damaging the CPU die. The frame itself provides mechanical protection for the delicate die and ensures even pressure distribution for optimal contact with the water block. The article also mentions the challenges of achieving a flat surface and even mounting pressure when dealing with direct die cooling, which the frame aims to address.
While the article doesn’t provide specific benchmark numbers, it hints at a substantial temperature reduction based on early testing. The success of this product hinges on its ability to maintain consistent contact and prevent damage to the CPU die during installation and use.
Commentary
Direct-die cooling represents a niche but potentially significant advancement in CPU cooling technology. By eliminating the IHS, it offers a more direct and efficient path for heat transfer, potentially allowing for lower temperatures and higher overclocking headroom.
The Direct Die Frame from Supercool.org addresses some of the key challenges associated with direct-die cooling, such as the risk of damaging the CPU die during delidding and the difficulty of achieving consistent contact pressure. The inclusion of a delidding kit is a welcome addition, making the process more accessible to enthusiasts.
However, it’s important to consider the risks involved. Delidding voids the CPU warranty, and improper installation of the direct-die cooler can permanently damage the CPU. Therefore, this type of cooling solution is primarily suited for experienced users comfortable with these risks. The market impact will likely be limited to high-end enthusiasts and overclockers seeking the absolute best cooling performance.